bonding pad

New Type Roller Contour of Bonding Pad Roll for SSAW Pipe Unit

新型螺旋焊管机组焊垫辊辊型

Layer thickness analysis results from a bonding pad on a circuit board, showing nanometer resolution thickness analysis.

来自电路板结合区的厚度分析，纳米尺度的厚度分析。

The influence of junction area and bonding pad size on the dark current has been also analyzed.

文中还对器件结面积和电极尺寸等对暗电流的影响进行了比较和分析。

To avoid this problem, the effective bonding pad sizes and spacing must be reduced.

为了避免这个问题, 有效的键合压脚尺寸和间距都必须减少.

This phenomenon indicates that the strength of the IMC layers which connect the BGA and bonding pad is increased by adding nanoparticles.

这说明了钎料与焊盘连接处的IMC的强度在添加纳米颗粒后得到了明显的提高。

This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital Image Processing and Pattern Recognition.

介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。

The hardness distributing near bonding pad and strength of interface have been studied. The interface structure and bonding mechanism of electromagnetic hemicontinuous double pouring casting roll have been analyzed.

研究了结合界面附近的硬度分布和界面的结合强度，并分析了电磁半连续复合铸造轧辊的界面结构和结合机理。

In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.

文章对QFN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。